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EDI Con Calls for Submissions

EDI Con Calls for Submissions
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EDI CON presentersEDI CON uniquely brings together RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators for networking, training, and learning. At EDI CON, designers will see techniques and technologies used in other applications that could be applied or adapted to solve their latest design challenges. Focused on what will best help attendees, the Technical Advisory Committee reviews abstracts for quality, relevance, impact, and originality. Submit your work today! (Deadline April 15, 2016). For more information: www.ediconusa.com/callforpapers.asp.

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