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Wafer Level Chip Scale Package 

Wafer Level Chip Scale Package 
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Targeting next-generation wearables and space-constrained IoT applications, the nRF52832 Wafer Level Chip Scale Package (WL-CSP) has a super-compact 3.0 x 3.2mm footprint that occupies ¼ of the footprint area of the company’s standard 6.0 x 6.0mm QFN48-packaged predecessor, yet offers the same full feature set.

NORDIC SEMICONDUCTOR

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