How to Balance Process Variables and Wire Bond Tool Customizations to Handle Small MESA Chips
SemiGen, Inc. (www.semigen.net), an ISO and ITAR registered RF/Microwave assembly, automated PCB manufacturing, and RF Supply Center, announces a new Technical Brief, “Tips for Increasing Yields when Wire Bonding Small MESA Chips,” discussing the challenges of wire bonding to small MESA chips. This latest brief provides insights into the wire bonding process and shares tips on how to analyze and overcome the pitfalls when wire bonding small MESA chips.
Progressively, MESA chips have decreased in size. These shrinking chip geometries also result in smaller pitches, bad widths, wire bond diameters, and bonding areas. Higher data rates, signal integrity requirements, and greater performance metrics for RF/microwave connections have also required greater precision wire bonding and reduced parasitics associated with wire bond lengths, diameters, and wire bond quality. With sub-1-mil wire diameters and sub-40-micron wire bonding areas, developing a reliable and repeatable wire bond process, automated or manual, has become an escalating challenge.
With extensive experience in wire bonding small MESA chips, and meeting the robust standards and quality demands of military, aerospace, and satellite communications, experts with SemiGen have formulated methods to optimize a wire bonding process to deliver exceptional repeatability and reliability. Some of this knowledge and perspective is shared in their latest technical brief.
Learn more by reading the Technical Brief, “Tips for Increasing Yields when Wire Bonding Small MESA Chips.”
SemiGen is a leading RF/Microwave solutions company that provides manufacturing services and products to fill the voids in the supply chain and manufacturing floor. SemiGen’s design and manufacturing center includes RF/Microwave assembly, PCB, box build, module repair and test services coupled with the semiconductor devices and manufacturing supplies needed for successful products in the RF/Microwave hybrids and components. Their team helps with designs, builds prototypes, and handles volume production runs for the RF/Microwave, military, space, homeland security, optical, medical device, and commercial wireless markets. Their 17,000 square foot facility includes a class 10,000 clean room and offers manual to full automatic assembly for any manufacturing challenge. The company was founded in 2009 and is based in Manchester, NH. For more information, visithttp://www.semigen.net