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EDI CON USA 2018: Call For Abstracts

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Give a Talk at EDI CON!

Here’s your chance to share your expertise, explain an often misunderstood technical point, or share your latest research with engineers working on RF, microwave, and/or high-speed digital designs. EDI CON USA 2018 uniquely brings together engineers, designers, and systems integrators working on analog as well as digital designs in a conference and exhibition at the Santa Clara Convention Center, Santa Clara, CA Oct 17-19. Join the best of the best of industry experts, speak to your colleagues and peers, and help solve next-generation technical issues. If your abstract is accepted by the EDI CON USA Technical Advisory Committee, you will receive free conference admission ($599 value–including all-day training at EDI CON University on October 19th, as well as networking opportunities), and be eligible for an Outstanding Paper Award and online publication in Microwave Journal and/or Signal Integrity Journal. 2018 Conference Chairs: Jin Bains, Head of Connectivity, SCL, at Facebook & Ransom Stephens, Ph.D., author, technologist, and physicist. Conference Highlights: Tutorials, Keynotes, Short Courses, Technical Sessions, Workshops, Speed Training, and Panel Sessions as well as product demonstrations on the Exhibition Floor.

SUBMIT AN ABSTRACT (DEADLINE MAY 3): http://www.ediconusa.com/callforpapers.asp

Planned Tracks:

  • RF & Microwave Design
  • Mobile Front End Design
  • Low Power RF & IoT
  • 5G Advanced Communications
  • Broadband Networks
  • Radar & Defense
  • Amplifier Design
  • Signal Integrity
  • Power Integrity
  • EMC/EMI
  • Simulation & Modeling
  • Test & Measurement
  • mmWave

 

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