CIN::APSE solderless, high density, stacking interconnects are used for board to board, flex to board, and component to board applications. They are found in applications where a mezzanine style PCB layout is utilized to reduce space and weight. Its 1.0mm pitch accommodates high density circuits between boards. The CIN::APSE mechanical contacts are durable for applications that require several cycles of disconnections for modifications or testing. The mechanical contacts also reduce the need for soldering and subsequent inspection.