MPD Fully Functioning During the Covid-19 Emergency

We just thought we’d let all of you know that it is business as usual at Octagon Communications and MPD. All necessary precautions have been taken, and, as several of our staffers already work remotely, the office is open for business until we are told otherwise.

The March issues of MPD and MMD will arrive on schedule, and of course our website and the digital edition will continue to be available.

Feel free to contact any of us with questions or concerns!

We hope that you and your families are safe and healthy.

Home On The Market CIN::APSE® Stacking Connectors

CIN::APSE® Stacking Connectors

CIN::APSE® Stacking Connectors

CIN::APSE solderless, high density, stacking interconnects are used for board to board, flex to board, and component to board applications. They are found in applications where a mezzanine style PCB layout is utilized to reduce space and weight. Its 1.0mm pitch accommodates high density circuits between boards. The CIN::APSE mechanical contacts are durable for applications that require several cycles of disconnections for modifications or testing. The mechanical contacts also reduce the need for soldering and subsequent inspection.