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High-Performance Packaging

High-Performance Packaging
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Thermally-efficient packages for compound semiconductor devices, such as gallium nitride (GaN) and gallium arsenide (GaAs), enable these devices to meet the critical requirements of markets such as telecom, mixed signal, VSAT, broadband wireless, satellite, military, test and measurement, and more. The company uses hardened, or post-fired, ceramic that does not shrink, resulting in complete dimensional stability and precise mechanical tolerances. It then mates these ceramics with its patented electrical transition designs to manufacture semiconductor packages with exceptionally low electrical losses that operate efficiently, even at frequencies as high as 63+ GHz. It also offers complete automated assembly services for these packages, including gold-tin solder die attach. 

STRATEDGE CORPORATION

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