IN MY OPINION

The Multidimensional Alan Borck
By Charles Alan Borck, Founder, RLC Electronics

Charles Alan Borck, founder of RLC Electronics in Mt. Kisco, NY, died on March 1 at 87.

No one who ever did business with Alan Borck would ever consider him indecisive or indirect. While he was a man of few words, they were always what he believed to be the truth, like them or not. Alan was a stand-up guy, and a very bright one as well.

Read More...
FROM WHERE WE SIT

Uncertain Times for DefenseAnother Sad Moment For the FCC
By Barry Manz

A significant number of rooftop antenna sites owned primarily by wireless carriers exceed FCC public and occupational exposure limits, make it impossible for workers to avoid standing in front of antennas, and are inadequately posted with warnings and barriers. Read More...


CURRENT ISSUE PRODUCTS


High Power Duplexers and Triplexers
A new line of high power duplexers and triplexers designed for 4G LTE build-out has been released. It includes the Model FD2001 DIN-R Duplexer, Model FT2001 DIN-R Triplexer, and Model FT2001(D) DIN-R Dual Triplexer.

Trilithic RF & Microwave

Versatile New LNAs
Two packaged low noise amplifier (LNA) gain blocks deliver cost-effective high performance over very broad bandwidths of 50 MHz to 4 GHz. They combine very high linearity with very low noise figures, making them ideal for high-performance wireless infrastructure.
Triquint Semiconductor

Precision Coaxial Connectors Precision Coaxial Connectors
A new line of precision coaxial connectors for semi-rigid and flexible cables is now available. Interfaces include Type N, Type N Right Angle, SMA and TNC connectors that provide excellent VSWR from DC to 18 GHz. Stainless steel passivated construction.
Vida RF

Modular WLAN 802.11ac Test System
A new test system based on the company’s PXI 3000 Series modular instrumentation has been designed to offer measurements over a 160 MHz bandwidth at operating frequencies up to 6 GHz. It is particularly suited for making R&D, design verification, and production measurements on WLAN devices based on the IEEE 802.11ac standard.
Aeroflex Limited

Signal Analyzer Frequency Options
Two new frequency options for the N9000A CXA X-Series signal analyzers provide a low-cost solution for essential microwave signal characterization up to 13.6 and 26.5 GHz. Features include quick measurement of spurs and harmonics due to the CXA’s speed and DANL performance.
Agilent Technologies

Hand-Flex™ Coaxial Cable
The 141-20SM+ Hand-Flex coaxial cable is ideal for interconnection of coaxial components or sub-systems. The construction includes a silver-plated copper clad steel center conductor which maintains the shape after bending. Frequency coverage is DC to 18 GHz.
Mini-Circuits

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August 2008

TDR-Based Antenna Measurements Allow Fast, Accurate and Cost-Effective Testing of Millimeter-Wave Patch Antennas
By Chris Scholz, Ph.D., Field Applications Engineer, LeCroy Corporation
Prof. Haiying Huang, Assistant Professor, University of Dallas at Arlington


Introduction
Time domain methods, such as time-domain reflectometry/transmission (TDR/T), are well established methods for digital designers, signal integrity engineers, and optical scientists. RF and wireless engineers generally prefer frequency domain methods, such as vector network analysis, as a characterization method. Recent advances in semiconductor processing and wireless sensor development have blurred the clear distinction between the digital and the analog world. As a consequence, new methodologies that combine time domain and frequency domain technologies are necessary.

LeCroy’s WaveExpert digital sampling oscilloscopes (Figure 1) combine time domain and frequency domain analysis in a compact and cost-effective package that enables the development of innovative test and measurement techniques to meet the needs of many analog/RF and digital/signal integrity applications. One such application is the characterization of a dual-band millimeter wave patch antenna used in wireless sensing applications.

The TDR/T analysis and S-parameter measurement package for the WaveExpert provides the capability to perform time-domain and frequency domain measurements up to 20 GHz with a fully integrated TDR/T analysis with S-parameter extraction. The package enables single-ended and true differential S-parameter measurements, automated deskew, and time domain measurements with sub-millimeter resolution to be made with the sampling oscilloscope. Advanced open/short/load (OSLT) calibration removes the effects of cables, fixtures, etc. from measurements for improved accuracy.

The device under test (DUT) is a wireless sensor used to monitor changes in load condition of structural elements, such as airframes. To take full advantage of the sensor, it is essential to measure dynamic changes in it. Due to the required off-line processing, it is not feasible to apply conventional vector network analysis techniques under dynamic operating condition. The sensor under test was developed in the Advanced Sensor Technology Laboratory (ASTL) at the University of Texas, Arlington. A key component of the sensor is a millimeter-wave patch antenna that consists of a 2 mm x 4 mm copper patch on a duroid substrate.

Operating Principle
TDRs operate in the time domain by launching a 20 ps step into the antenna and measuring reflected waveforms. The acquisition window is selected by inspecting the received waveform and adjusting the time window so all reflections of the sensor are visible in the oscilloscope trace. After performing an advanced OSLT calibration, frequency domain scattering parameters (S-parameters) are automatically calculated by the sampling oscilloscope and displayed on the screen.

In contrast, Vector Network Analyzers (VNAs) operate in the frequency domain. A sinusoidal wave is launched into the device. The reflected signal is filtered via a very narrowband filter that accurately tracks the source frequency. If the transmitter and receiver are synchronized and swept in frequency, a steady state frequency response of the sensor can be acquired.

Comparison of Antenna Measurements Using TDR and VNA Measurements
Figure 2 shows a comparison of the S11 parameters acquired using a WaveExpert with the TDR/T and S-parameter package (solid red trace) and a conventional VNA (dashed blue trace). Dips in the reflection of the antenna’s spectrum at around 12 GHz and 17.5 GHz indicate the transmission bands of the antenna.

Both methods yield more than adequate measurements results of the sensor. The main difference between the measurements is the smaller dynamic range of the TDR measurements. For the sensor under test, only relative changes in transmission frequency are important; differences in dynamic range of the two measurement techniques are of lesser importance. One advantage of the WaveExpert is that dynamic changes in the sensor’s characteristics can be measured easily by simply monitoring changes in the oscilloscope’s display. To implement similar capabilities using a traditional VNA, tools to have advanced control of the VNA, off-line data analysis, and extensive digital signal processing would be required.

Conclusion
TDR is a powerful tool when characterizing high-speed wireless components and devices. As the clear distinction between the analog and digital world vanishes, time-domain methods will become valuable tools for wireless and RF engineers to characterize dynamic changes in RF performance. In contrast to traditional vector network analysis, TDR measurements are intuitive and thus become valuable tools in enabling communications between digital, signal integrity and RF engineers.

The primary advantage of a VNA over TDR techniques are in the higher dynamic range of VNA measurements. TDR measurement tools, however, are significantly less expensive than VNAs and meet the requirements of many practical measurement needs.

LeCroy Corporation
www.lecroy.com
TXTLINX.COM67
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March 2013

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WHITE PAPERS

Directivity and VSWR Measurements
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Switch Solutions for Systems with Low PIM Requirements
Dow-Key Microwave has invested in R&D for new RF switch products designed specifically to reduce intermodulation (IM) in coaxial switches.
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How to Specify RF and Microwave Filters
Covers cavity, ceramic, LC, crystal and helical filters.
Anatech Electronics

Mounting Considerations for Medium Power Surface-Mount RF Devices
Covers all factors that must be considered when mounting SMT devices.
TriQuint Semiconductor

Biasing MMIC Amplifiers
How to bias MMICs along with theory and techniques.
Mini-Circuits


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