In The News...

• CEL Congratulates NEC Electronics on Completion of Merger
• Joe Zachman Joins Endicott Interconnect Technologies, Inc. as COO
• Harris’ High-Capacity Line-of-Sight Radio Receives U.S. Government Certification
• TEGAM Opens Office in China
• NXP Opens High Performance RF Product Creation Center in USA
• Agilent Technologies Chipset Software Supports picoChip Femtocell Test


CEL Congratulates NEC Electronics on Completion of Merger
California Eastern Laboratories (CEL) congratulates its long-standing partner, NEC Electronics, on the completion of its merger with Renesas Technology Corporation. The new entity, Renesas Electronics Corporation, continues its 50 year partnership with CEL.
The supply of CEL products that come from NEC Electronics, including RF switches, power amplifiers, low noise amplifiers, optocouplers, solid state relays, lasers, and detectors, will continue without interruption. “We are delighted that the uncertainty caused by the pending merger is behind us. Now, without any distractions, CEL and the new Renesas can confidently bring the best RF and optical semiconductors to market,” said Paul Minton, president and CEO for California Eastern Laboratories. “Mergers happen, but we are still us. We are still CEL, dedicated to the same great products and same great service our customers have come to expect. And we are looking forward to another 50 plus years of working with the new Renesas and serving our key customers and partners.” California Eastern Laboratories (www.cel.com) is the exclusive sales and marketing partner for products made by the Compound Semiconductor Devices Business Division (CSDBD) of Renesas Electronics Corporation.
www.cel.com

Joe Zachman Joins Endicott Interconnect Technologies, Inc. as COO
Endicott Interconnect Technologies, Inc. (EI) has hired Joe Zachman for the position of Chief Operating Officer, reporting to James J. McNamara Jr., president and CEO at EI. In this new position, Mr. Zachman will have responsibility for all manufacturing operations, procurement, materials, and maintenance operations. “As COO, Joe will be responsible for establishing new manufacturing protocols, refining manufacturing process controls, and improving EI’s Business Excellence initiatives in order to drive enhanced on-time delivery, reduce expenses, and maximize efficiencies throughout our manufacturing operations,” stated Mr. McNamara. “With his extensive background in operations, Joe is well positioned to link the needs of the industry to operational excellence and streamline our business processes for continued growth and profitability. Joe will play a key role in our corporate efforts to transform EI from a good company to a great company.” Joe brings to EI a proven track record in managing and strengthening large enterprises, most recently as Senior VP and Chief Operating Officer for Wabash National Corporation in Lafayette, Indiana. Prior to Wabash, Joe was VP and General Manager for TTM Technologies, Inc. in Wisconsin and was former Director of Operations at Hadco Corporation in Owego, NY (now Sanmina-SCI Corporation). He earned his BS in mechanical engineering from Purdue University, College of Technology and his MS in manufacturing management from Kettering University.
www.eitny.com

Harris’ High-Capacity Line-of-Sight Radio Receives U.S. Government Certification
Harris Corporation, an international communications and information technology company, has received a significant certification from the U.S. government for its RF-7800W High-Capacity Line-of-Sight Radio – which transmits high-bandwidth data over long-range wireless battlefield communication networks. This certification validates that the RF-7800W meets design and implementation standards for information security as required by the U.S. government. The National Institute of Standards and Technology has certified that the radio meets the requirements of Federal Information Processing Standard (FIPS) 140-2 Level 2. This designation assures Harris defense and government customers that RF-7800W embedded cryptography and management interfaces meet the government's strict communications security requirements for handling sensitive but unclassified (SBU) data. "Harris is committed to providing solutions that provide a best-in-class combination of performance and security," said Steve Marschilok, president, Department of Defense business, Harris RF Communications. "The RF-7800W is critical to the rollout of next-generation information architectures for U.S. forces and other nations. This certification ensures the integrity and confidentiality of data sent using the RF-7800W." The Harris RF-7800W is a wireless IP networking radio used to establish high-speed wireless data connections for combat applications over long distances. The radio combines bandwidth and size efficiencies found in state-of-the-art commercial wireless technology with full military-grade communications security and packaging to provide rugged, reliable and secure high-bandwidth data communications. The RF-7800W provides a set of ground breaking protocols and techniques that secure the radio's wireless and management interfaces. Collectively known as Traffic Flow Security (TFS), these enhancements utilize industry-standard techniques and algorithms such as Federal Information Processing Standard- (FIPS) 197 certified AES encryption, digital certificates, and dynamic encryption key generation and exchange. The radio is a multi-use, multi-purpose SDR platform that is rugged and highly reliable in traditional backhaul applications for the U.S. Army, U.S. Marine Corps and 20 other nations worldwide. Versatile and highly portable, the RF-7800W also has enabled militaries to explore new ways of achieving broadband communications such as real time airborne, border protection, vehicular convoy on-the-move, and dockside infrastructure for ship to shore transmissions. The RF-7800W's highly flexible, highly secure, and robust waveform enables the radio to break through traditional line of site (LOS) restrictions and better serve users with one common platform.
www.harris.com

TEGAM Opens Office in China
TEGAM Inc., which designs, manufactures and supports a wide variety of electronic test, measurement and calibration instruments, is pleased to announce it has opened a new National Sales Office in Beijing, China. The strategic location of the office and the addition of key staff will enable TEGAM to better serve its existing customers in China. At full staff, the office will employ several people in sales and technical support capabilities. The Country Manager for the new office is Xuehua (Kevin) Zhang. Xuehua brings with him over 10 years of sales experience in China with electronic measurement instrumentation. Prior to joining TEGAM, he was Keithley Instruments’ Beijing Office Manager. He has been successful selling into the electronics manufacturing, aerospace, defense, wireless, and semiconductor industries. He is a graduate of Beijing Polytechnic University with a Bachelor’s Degree in automation. Applications/Sales Engineer Tom Ge has been hired to work directly with customers to meet their measurement challenges using TEGAM products. Mr. Ge has eight years of experience in product development, application support and sales. For five years, he worked at Keithley Instruments in both DC and RF Instrumentation. He is a graduate of Nanjing University of Science and Technology with a specialty in radar systems. “China is a significant and growing market for TEGAM and the necessity of being directly involved with the day-to-day needs of our customers greatly influenced the decision to open a sales office,” said Adam R. Fleder, president of TEGAM. “We are very pleased with the addition of both Mr. Zhang and Mr. Ge to the TEGAM team and look forward to using their knowledge and experience to better serve our customers.” Contact information for the China office is as follows: TEGAM Beijing Office, Room 317, E1 Yuanchenxin Building, 12 Yumin Road, Chaoyang, Beijing, 100029, Tel: 8610-82250997, 8610-82251181, Fax: 8610-82251938, e-mail: kevin.zhang@tegam.com

NXP Opens High Performance RF Product Creation Center in USA
NXP Semiconductors announced the opening of the high performance radio frequency (RF) product creation center (PCC) in Billerica, Massachusetts, U.S.A. This new NXP facility, located near Boston, will focus on the design of RF and Microwave integrated circuits (ICs) used in demanding applications such as defense & aerospace; Industrial, Scientific and Medical (ISM) satellite receivers; and broadband communications. Leveraging NXP’s unique IP, product portfolio, processes, and manufacturing capabilities, the design center will further enhance the position of NXP in these growing RF & Microwave markets. With its East Coast location, and close proximity to design teams in France and the Netherlands, the center will also strengthen the technical and application support provided to the company’s Americas-based customers. Uniquely positioned in the RF & Microwave market with a rich portfolio of high-performance processes in-house, NXP’s broad RF portfolio spans high-power LDMOS for power amplifiers to the latest SiGe:C BiCMOS for RF/IF MMICs. Additionally, advanced CMOS process for high-speed converters completes the RF front-end. As all these technologies are designed and manufactured in-house, they are custom-tuned to application-specific requirements.

NXP also has a long history as one of the industry’s leading compact model developers, so all technologies are supported by their associated, fully characterized RF models. This in-house process supports the company’s global design teams in leading innovation and the development of products and solutions for some of the most pressing RF front-end challenges. “This new product creation center builds upon NXP’s 50-year heritage in RF innovation, further refining, localizing and extending that competence to meet customer demands and create innovative applications,” said John Croteau, senior vice president and general manager of the High Performance RF and Lighting business lines at NXP Semiconductors. “Process, packaging, and circuit design innovation remain pillars of our strategy, yielding leadership positions in technologies such as SiGe:C, LDMOS and JESD204A.” Ian Gresham, general manager Boston PCC, NXP Semiconductors, added, “The deep pool of experienced and talented RF designers, the active RF customer base and the closeness to Europe make Boston the ideal location for the new NXP PCC. The PCC team will endeavour to push the limits of our high performance RF & Microwave products, overcoming market challenges through innovation.”.
www.nxp.com

Agilent Technologies Chipset Software Supports picoChip Femtocell Test
Agilent Technologies Inc. and picoChip announced a high-volume manufacturing test solution for 3G femtocell products. The jointly developed solution is based on picoChip’s picoXcell semiconductors and software, and Agilent’s N7310A chipset software. The new integrated manufacturing test solution delivers rapid calibration and verification testing capabilities for original design manufacturers (ODMs) and contract manufacturers (CMs). “Agilent’s N7310A chipset control software provides OEMs, module manufacturers and design houses with a reliable and efficient test solution,” said Garrett Lees, applications marketing manager at Agilent’s Microwave and Communications Division. “This solution speeds up product development and the production life cycle and ensures the fastest time to market.” David Maidment, VP of product management, picoChip, added, “Cellular network operators have recognized femtocells as a key enabling technology as they try to keep up with burgeoning user demand for data services. Bringing a consumer market approach to the network infrastructure business is not an easy transition. This new manufacturing test solution is a key part of our ability to provide the proven, fully tested solutions that the market requires.” Agilent N7300 software solutions are supported on the Agilent MXA, EXA, MXG and ESG analyzers and signal generators. To ensure investment protection, the software used in design, verification and manufacturing is compatible with Agilent’s X-series applications and test hardware. picoChip’s PC6201 manufacturing bundle is an open-systems-based support package for the company’s picoXcell femtocell solutions. The bundle includes a SCPI-based manufacturing interface, controlling test PHY and a radio application-programming interface. The new solution supports a full RF manufacturing test calibration and verification test plan. The bundle, which supports all the major 3G femtocell deployments to date, is optimized for picoChip’s PC3xx SoCs and builds on technology already proven in manufacturing environments. Femtocells are low-cost, compact base stations that work in licensed spectrum and connect into the cellular operator’s network via the Internet. Examples include AT&T’s Microcell and Vodafone’s Sure Signal. The products provide greatly improved indoor cellular coverage (voice and data) as well as increased network capacity across a variety of applications.
www.agilent.com