The Opportunities and Challenges of LTE Unlicensed in 5 GHz
David Witkowski, Executive Director, Wireless Communications Initiative
In 1998, the Federal Communications Commission established the Unlicensed National Information Infrastructure or U-NII 5 GHz bands. These are used primarily for Wi-Fi networks in homes, offices, hotels, airports, and other public spaces and also consumer devices. U-NII is also used by wireless Internet Service Providers, linking public safety radio sites, and for monitoring and critical infrastructure such as gas/oil pipelines.

MMD March 2014

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Band Reject Filter Series
Higher frequency band reject (notch) filters are designed to operate over the frequency range of .01 to 28 GHz. These filters are characterized by having the reverse properties of band pass filters and are offered in multiple topologies. Available in compact sizes.
RLC Electronics

SP6T RF Switch
JSW6-33DR+ is a medium power reflective SP6T RF switch, with reflective short on output ports in the off condition. Made using Silicon-on-Insulator process, it has very high IP3, a built-in CMOS driver and negative voltage generator.

Group Delay Equalized Bandpass Filter
Part number 2903 is a group delayed equalized elliptic type bandpass filter that has a typical 1 dB bandwidth of 94 MHz and a typical 60 dB bandwidth of 171 MHz. Insertion loss is <2 dB and group delay variation from 110 to 170 MHz is <3nsec.
KR Electronics

Absorptive Low Pass Filter
Model AF9350 is a UHF, low pass filter that covers the 10 to 500 MHz band and has an average power rating of 400W CW. It incurs a rejection of 45 dB minimum at the 750 to 3000 MHz band, and power rating of 25W CW from 501 to 5000 MHz.

LTE Band 14 Ceramic Duplexer
This high performance LTE ceramic duplexer was designed and built for use in public safety communication and commercial cellular applications. It operates in Band 14 and offers low insertion loss and high isolation to enable clear communications in the LTE network.
Networks International

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January 2014

A Case for Microelectronic Packaging and Assembly in the U.S.
By Casey Krawiec, Global Sales and Marketing Manager

Liam Devlin, CEO, Plextek RF Integration

Flexible manufacturing! Fast time-to-market! Easy communication! These are all answers to the hypothetical game show question, “What do you need from your U.S. packaging and assembly supplier?” Chip designers are often pushed to validate the performance of their new designs as quickly as possible. The time-to-market is often paramount. Validation can be a time-consuming process, especially if it takes several iterations before you are satisfied with the performance of the packaged device.

How many evening conference calls do you have to have with your overseas Outsourced Semiconductor Assembly and Test (OSAT) provider to make this happen? When millions of units need to be produced, it’s clear that the OSAT overseas is going to make it worth your while to use them.

However, when there aren’t millions of units needing assembly, as is often the case with MW and RF components, engineers in the U.S. have learned that it makes sense to have their devices assembled in the U.S. The same is true when the packaging and assembly isn’t so simple and routine. With design engineers wanting clear communication and IP protection, they don’t want to use overseas suppliers. Intellectual property protection concerns are mitigated by having a U.S.-based packaging and assembly supplier. The concern is particularly high for military customers and those customers having novel, cutting-edge technologies. In addition, the complexity of high frequency device packaging and assembly often requires close communication and special processes that only the U.S.-based supplier can offer.

There is a lot of talk about insourcing these days, with the term “insourcing” being defined as, “the return of manufacturing to the U.S.” Reasons given for the rise in insourcing include falling U.S. energy costs, rising overseas transportation costs (for both freight and travel), rising overseas wages relative to U.S. wages, and the discovery that there are a bunch of hidden costs when using an overseas supplier. What are these hidden costs? They include the time lost dealing with an inflexible manufacturer, slow response time that stretch out the time-to-market, and miscommunication that creates delays. U.S. companies like Quik-Pak, a division of Delphon, know what it takes to compete. At Quik-Pak, we’ve asked our customers what they need and they all tell us, “Save us time!” We do this by being nimble, responsive, and obsessed with clear and concise communication. If we didn’t, outsourced packaging and assembly would remain outsourced and a lot of U.S. engineers would miss dinner on a regular basis. U.S. microelectronic packaging and assembly companies have advantages, but you need to look at the big picture to recognize what they are.

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Uncertain Times for DefenseOpen’s Systems and Changes in DoD Procurement: This Time It’s Real
By Barry Manz

The U.S. Department of Defense has a well-earned reputation for inertia. Many proposals for change are made – but nothing happens. The COTS initiative, which promised cost savings through the use of off-the-shelf commercial parts, sounded terrific at the time. It heralded a major departure from standard DoD procurement that more or less guaranteed that every system would be different in part because it used parts that were developed from scratch, leading to “one-off” systems that were very expensive. Read More...

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