Innovation: The Answer to a Flat Market
By Harvey Kaylie, Founder and CEO, Mini-Circuits
Some might say business seems flat lately. The financial crisis in Greece has led to economic turmoil in the EU. Opportunities in China have slowed, and when China sneezes, the whole world feels it. Read More...

MMD March 2014

Previous issues click here


Band Reject Filter Series
Higher frequency band reject (notch) filters are designed to operate over the frequency range of .01 to 28 GHz. These filters are characterized by having the reverse properties of band pass filters and are offered in multiple topologies. Available in compact sizes.
RLC Electronics

SP6T RF Switch
JSW6-33DR+ is a medium power reflective SP6T RF switch, with reflective short on output ports in the off condition. Made using Silicon-on-Insulator process, it has very high IP3, a built-in CMOS driver and negative voltage generator.

Group Delay Equalized Bandpass Filter
Part number 2903 is a group delayed equalized elliptic type bandpass filter that has a typical 1 dB bandwidth of 94 MHz and a typical 60 dB bandwidth of 171 MHz. Insertion loss is <2 dB and group delay variation from 110 to 170 MHz is <3nsec.
KR Electronics

Absorptive Low Pass Filter
Model AF9350 is a UHF, low pass filter that covers the 10 to 500 MHz band and has an average power rating of 400W CW. It incurs a rejection of 45 dB minimum at the 750 to 3000 MHz band, and power rating of 25W CW from 501 to 5000 MHz.

LTE Band 14 Ceramic Duplexer
This high performance LTE ceramic duplexer was designed and built for use in public safety communication and commercial cellular applications. It operates in Band 14 and offers low insertion loss and high isolation to enable clear communications in the LTE network.
Networks International

See all products in this issue


January 2014

A Case for Microelectronic Packaging and Assembly in the U.S.
By Casey Krawiec, Global Sales and Marketing Manager

Liam Devlin, CEO, Plextek RF Integration

Flexible manufacturing! Fast time-to-market! Easy communication! These are all answers to the hypothetical game show question, “What do you need from your U.S. packaging and assembly supplier?” Chip designers are often pushed to validate the performance of their new designs as quickly as possible. The time-to-market is often paramount. Validation can be a time-consuming process, especially if it takes several iterations before you are satisfied with the performance of the packaged device.

How many evening conference calls do you have to have with your overseas Outsourced Semiconductor Assembly and Test (OSAT) provider to make this happen? When millions of units need to be produced, it’s clear that the OSAT overseas is going to make it worth your while to use them.

However, when there aren’t millions of units needing assembly, as is often the case with MW and RF components, engineers in the U.S. have learned that it makes sense to have their devices assembled in the U.S. The same is true when the packaging and assembly isn’t so simple and routine. With design engineers wanting clear communication and IP protection, they don’t want to use overseas suppliers. Intellectual property protection concerns are mitigated by having a U.S.-based packaging and assembly supplier. The concern is particularly high for military customers and those customers having novel, cutting-edge technologies. In addition, the complexity of high frequency device packaging and assembly often requires close communication and special processes that only the U.S.-based supplier can offer.

There is a lot of talk about insourcing these days, with the term “insourcing” being defined as, “the return of manufacturing to the U.S.” Reasons given for the rise in insourcing include falling U.S. energy costs, rising overseas transportation costs (for both freight and travel), rising overseas wages relative to U.S. wages, and the discovery that there are a bunch of hidden costs when using an overseas supplier. What are these hidden costs? They include the time lost dealing with an inflexible manufacturer, slow response time that stretch out the time-to-market, and miscommunication that creates delays. U.S. companies like Quik-Pak, a division of Delphon, know what it takes to compete. At Quik-Pak, we’ve asked our customers what they need and they all tell us, “Save us time!” We do this by being nimble, responsive, and obsessed with clear and concise communication. If we didn’t, outsourced packaging and assembly would remain outsourced and a lot of U.S. engineers would miss dinner on a regular basis. U.S. microelectronic packaging and assembly companies have advantages, but you need to look at the big picture to recognize what they are.

Email this article to a friend!



You Can
Search by Number:

  All ads, articles, and products in printed issues of MPD have a number. Just look for the red arrow in the ad or at the end of the article or product description.


Uncertain Times for DefenseWill OpenRFM Shake Up the Microwave Industry?
By Barry Manz

Throughout the history of the RF and microwave industry there has never been a form factor standardizing the electromechanical, software, control plane, and thermal interfaces used by integrated microwave assemblies (IMAs) employed in defense systems. Rather, every system has been built to meet the requirements of a specific system, which may be but probably isn’t compatible with any other system. It’s simply the way the industry has always responded to requests from subcontractors that in turn must meet the physical, electrical, and RF requirements of prime contractors. Read More...

Home | About Us | Archives | Editorial Submissions | Media Kit (PDF) | Events | Subscribe/Renew | Contact Us
Copyright © 2014 Octagon Communication Inc. DBA MPDigest /, All Rights Reserved.
Privacy Policy | Site Map