Home Tag "EDI CON"

Outstanding Papers Take the Stage at EDI CON USA 2018

This year’s event has a wide range of papers, winners are chosen by the Technical Advisory Committee. October 10, 2018 (Norwood, Mass.) – EDI CON USA, the industry event that brings together RF/microwave and high-speed digital design engineers and system integrators in Santa Clara Convention Center on October 17 and 18, announces the finalists in […]

Ransom Stephens and Ovi Jacob Headline EDI CON USA 2018 Plenary Keynotes

Industry leaders look to surprise, intrigue, and inspire this year’s attendees. EDI CON USA, the industry event that brings together RF/microwave and high-speed digital design engineers and system integrators, announces its plenary keynote speakers—Ovi Jacob and Ransom Stephens—for the 2018 conference, which will be held in Santa Clara, CA October 17 and 18. All passholders […]

EDI CON USA 2018: Call For Abstracts

Give a Talk at EDI CON! Here’s your chance to share your expertise, explain an often misunderstood technical point, or share your latest research with engineers working on RF, microwave, and/or high-speed digital designs. EDI CON USA 2018 uniquely brings together engineers, designers, and systems integrators working on analog as well as digital designs in […]

EDI Con Calls for Submissions

EDI CON presentersEDI CON uniquely brings together RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators for networking, training, and learning. At EDI CON, designers will see techniques and technologies used in other applications that could be applied or adapted to solve their latest design challenges. Focused on what will best help attendees, […]