Home Tag "Laird Connectivity"

LoRaWAN + BLE Sensor with Probe

A new sensor features integrated antennas, an external temperature probe, and a rugged IP65 enclosure. The Sentrius RS1xx External Series probe allows customers to mount the sensor outside of a device and measure the temperature inside via the cabled sensor. Ideal for cold chain management and more.  LAIRD CONNECTIVITY (61)

Ultra Low-Profile DAS Antenna

The CFSA35606P is said to be the world’s thinnest, ultra low-profile DAS antenna with the broadest range of frequency coverage. It is a low PIM, ceiling mounted antenna with omnidirectional pattern coverage optimized for indoor DAS coverage at 350 to 520, 600 to 960, 1350 to 1550, and 1690 to 6000 MHz for the UHF, […]

New 60 Series System on Module (SOM)

The 60 Series System on Module is based on the Microchip SAMA5D36 and provides superior enterprise-class Wi-Fi connectivity with full support for 2×2 MU-MIMO 802.11ac WLAN plus Bluetooth® 4.2 dual-mode. The 30 x 30mm form factor minimizes design space requirements. LAIRD CONNECTIVITY (10)

Bluetooth® 5 Module Series

The BL651 Series is a cost-effective solution for simple Bluetooth Low Energy (BLE) applications. It provides all of the capabilities of the Nordic nRF52810 silicon in a small, fully certified module, leveraging the benefits of Bluetooth 5 features (higher data throughput, increased broadcasting capacity) in one tiny footprint.   LAIRD CONNECTIVITY (18)

FlexMIMO Embedded PIFA Antenna

The FlexMIMO is the industry’s first flexible PIFA antenna for Wi-Fi MIMO applications. It has two integrated 2.4/5 GHz dual-band antenna elements specifically designed for 802.11 MIMO applications, such as automated equipment, medical devices, and a myriad of IoT use cases. The FlexMIMO is based on a Planar Inverted-F Antenna (PIFA) structure, comprised of two […]

Bluetooth 5 Series

The new Bluetooth® 5 series enables vital performance improvements with up to four times the range and twice the data throughput. The BL654 Series reduces engineering burden, design risk, and time-to-market when integrating Bluetooth Low Energy (BLE), Thread (802.15.4), and NFC capabilities into an OEM design.  LAIRD CONNECTIVITY (109)