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Solder Joint Reliability Assessment for a High Performance RF Ceramic Package

by Paul Charbonneau, Hans Ohman, Marc Fortin – Sanmina Corporation Solder joint reliability prediction continues to be a critical aspect of a reliability assessment of microelectronic packages and electronic hardware and systems in general.  Solder joint failure due to temperature cycling induced creep is considered the dominant failure mechanism in a “Central Office” environment.  Coefficient […]