Home Tag "Smiths Interconnect"

Volta Series Probe Heads

The Volta Series probe heads are optimized for wafer level chip scale package testing. Volta is used for testing the powerful integrated chips (while in wafer form) that are behind everything from Bluetooth® and power management to digital display controllers, ensuring that they are up to specification. SMITHS INTERCONNECT (16)

Microwave Circulators Evolve to Meet True Surface Mount Requirements of Advanced Systems

by Smiths Interconnect If it’s solving design challenges of directivity and throughput in 5G communications applications or providing enhanced anti-jamming and tracking agility, phased array antennas, or actively electronically steered arrays (AESAs), are essential to meeting the application demands of these emerging technologies. Phased array antennas and AESAs are now deployed in ground-based, aerospace, and […]

Smiths Interconnect Launches BrandTransition to Simplify Customer Access to Technologies and Solutions

Smiths Interconnect, a division of Smiths Group plc, today announces it is unifying its technology brands of EMC Technology, Hypertac, IDI, Lorch, Millitech, RF Labs, Sabritec, TECOM, and TRAK under the single brand identity of ‘Smiths Interconnect’. This brand transition supports a recent strategic reorganisation focused on creating a more agile structure that can better […]

Smiths Interconnect Launches Brand Transition

Smiths Interconnect, a division of Smiths Group plc, today announces it is unifying its technology brands of EMC Technology, Hypertac, IDI, Lorch, Millitech, RF Labs, Sabritec, TECOM, and TRAK under the single brand identity of ‘Smiths Interconnect’. This brand transition supports a recent strategic reorganisation focused on creating a more agile structure that can better […]