EDI CON USA 2018: Call For Abstracts
Give a Talk at EDI CON!
Here’s your chance to share your expertise, explain an often misunderstood technical point, or share your latest research with engineers working on RF, microwave, and/or high-speed digital designs. EDI CON USA 2018 uniquely brings together engineers, designers, and systems integrators working on analog as well as digital designs in a conference and exhibition at the Santa Clara Convention Center, Santa Clara, CA Oct 17-19. Join the best of the best of industry experts, speak to your colleagues and peers, and help solve next-generation technical issues. If your abstract is accepted by the EDI CON USA Technical Advisory Committee, you will receive free conference admission ($599 value–including all-day training at EDI CON University on October 19th, as well as networking opportunities), and be eligible for an Outstanding Paper Award and online publication in Microwave Journal and/or Signal Integrity Journal. 2018 Conference Chairs: Jin Bains, Head of Connectivity, SCL, at Facebook & Ransom Stephens, Ph.D., author, technologist, and physicist. Conference Highlights: Tutorials, Keynotes, Short Courses, Technical Sessions, Workshops, Speed Training, and Panel Sessions as well as product demonstrations on the Exhibition Floor.
SUBMIT AN ABSTRACT (DEADLINE MAY 3): http://www.ediconusa.com/callforpapers.asp
Planned Tracks:
- RF & Microwave Design
- Mobile Front End Design
- Low Power RF & IoT
- 5G Advanced Communications
- Broadband Networks
- Radar & Defense
- Amplifier Design
- Signal Integrity
- Power Integrity
- EMC/EMI
- Simulation & Modeling
- Test & Measurement
- mmWave
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