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Outstanding Papers Take the Stage at EDI CON USA 2018


This year’s event has a wide range of papers, winners are chosen by the Technical Advisory Committee.

October 10, 2018 (Norwood, Mass.) – EDI CON USA, the industry event that brings together RF/microwave and high-speed digital design engineers and system integrators in Santa Clara Convention Center on October 17 and 18, announces the finalists in the Outstanding Paper Awards competition for 2018.

Papers were judged on relevance and technical merit by the EDI CON USA Technical Advisory Committee. Winners will be announced on October 18that 4:30 PM in the Frequency Matters Theater on the show floor. Congratulations to the finalists:

Simulation and Modeling Finalists

  • Cut-off Frequency Prediction for MMW Coaxial Interconnects

Authors: Tom Clupper (WL Gore & Assoc), Charlotte Blair (ANSYS), and James Broomall (WL Gore & Assoc)

  • Causality in Power Delivery Network (PDN) Extractions in Package & Board

Author: Vinod Arjun Huddar (Western Digital)


5G and Advanced Communications Finalists

  • RF Front-end Technology and Tradeoffs for 5G mmWave Fixed Wireless Access

Author:Bror Peterson (Qorvo)

  • Realistic Antenna Array Modeling for 5G Communications

Author:  Laila Salman (ANSYS Canada)

  • Spatial Filters for Wireless Communication

Authors: Edward Liang and Te-Kao Wu (MCV Microwave)


mmWave Finalists

  • Advances in Technology and Design of UWB mmWave Planar and Non-Planar Diplexers for Applications up to 100GHz

Author: Irfan Ashiq (NI Components)


  • RF Technology for 5G mmwave Basestations

Author: Thomas Cameron (Analog Devices)

  • All-Silicon Active Antennas for High Performance mmWave Systems

Authors: Alastair Upton and Ian Gresham (Anokiwave)


RF and Microwave Design Finalists

  • Design of a Compact, Planar Triplexer Covering DC to 9 GHz and Implemented on Low-Cost Softboard

Authors: Utkarsh Unnikrishna and Paul Khanna (National  Instruments)

  • IQ Impairments and Correction in Wideband Transmitters

Author: Shannon Wanner (iDirect)

  • Optimization Approaches for Digital Controlled Tunable Filters for Receivers

Authors: Yarkin Yigit (ASELSAN) and Erdem Yazgan (TED University)

  • A Traceable Workflow for Software Defined Radio Development

Authors: Travis Collins and Andrei Cozma (Analog Devices)

  • Reliability Without Hermeticity: Further Development in Commercial Vapor Deposited Coatings for High-Frequency RF Microelectronics

Authors: Scott Morrison and Shannan O’Shaughessy (GVD Corporation)

  • Network Synthesis Accelerates Impedance Matching Circuit Design

Authors: Dr. John Dunn (AWR) and Ben Parry (National Instruments)


Signal Integrity Finalists

  • Practical Application of the IEEE P370 Standard for Measurement of Interconnects up to 50 GHz

Author: Jay Diepenbrock (SIRF Consultants)

  • IEEE P370:A Fixture Design and Data Quality Metric Standard for Interconnects up to 50 GHz

Author: Jay Diepenbrock (SIRF Consultants)


  • Signal Integrity Analysis on Integrated Thin Film High Density Organic Package Technology for Next Generation Applications

Authors: Surender Singh and Taranjit Kukal (Cadence Design System)

  • Demystifying Edge Launch Connectors

Authors:  Raul Stavoli, Davi Correia, and Emad Soubh (Carlisle Interconnect Technologies)

  • COM for PAM4 Link Analysis – What You Need to Know

Authors: Geoffrey Zhang, Min Huang, and Hongtao Zhang (Xilinx)

  • Via Characterization and Modeling by Z Input Impedance

Author: Heesoo Lee (Keysight Technologies)

  • Comparison of Embedded Coplanar Waveguide and Stipline for Multi-Layer Boards

Author: Milica Markovic (California State University Sacramento)


Test and Measurement Finalists

  • High Speed/mm-wave Measurement-Based Model Development: Uncertainties and Model Sensitivities

Author: Jon Martens (Anritsu)

  • Methods for Permittivity, Permeability, and Loss Measurements of Polymer Composite Magneto-Dielectric Laminates

Authors:  Allen Horn III, Christopher Caisse, Patricia LaFrance, and Karl Sprentall (Rogers Corporation)


Power Integrity Finalist

  • The 2-Port Shunt-Thru Measurement and the Inherent Ground Loop

Authors: Anto Davis and Steve Sandler (Picotest)


In addition to the two full days of conference programming, EDI CON USA offers special events including EDI CON University, the 5G Symposium, the High-Speed Digital Symposium, workshops, and panels. The event also includes a celebration of innovation in the EDI CON EXPO hall, complete with show-floor networking opportunities, happy hour, and speed trainings.

More information and registration is available http://www.ediconusa.com.

Take 30% off a conference pass or get a free EXPO pass with the code

#EDICON18. EDI CON USA 2018 is supported by its primary media sponsors, Microwave Journal and Signal Integrity Journal.


EDI CON USA uniquely brings together RF, microwave, EMC/EMI, and high-speed digital design engineers and system integrators for networking, training, and learning opportunities. Attendees come to EDI CON USA to find solutions, products, and design ideas that they can put into immediate practice for today’s communication, defense, consumer electronics, aerospace, and medical industries. Drawing attendees from both the analog and digital spheres, EDI CON enables designers to see techniques and technologies used in other applications that could be applied or adapted to solve their latest design challenges. The exhibition hall features product displays, demonstrations, interactive sessions, speed trainings, networking opportunities, and educational talks that address all aspects of design, simulation, test, and verification. www.ediconusa.com

About the Organizers
EDI CON USA is organized by Microwave Journal, the Signal Integrity Journal, and the event planning division of their parent company, Horizon House. Microwave JournalSignal Integrity Journal, and Horizon House also team with Microwave Journal China and ACT International (Hong Kong) to organize and produce EDI CON China (April 16-18, 2019). An experienced and well-established organizer of targeted events, Horizon House additionally organizes European Microwave Week (EuMW) on behalf of the European Microwave Association (EuMA). To subscribe to Signal Integrity Journal, visit www.signalintegrityjournal.com. To subscribe to Microwave Journal, visit http://www.mwjournal.com.


Janine Love, Event Director
Twitter: @tb_janine


Carl Sheffres, Exhibition Manager