The company’s line of off-the-shelf molded ceramic packages can be configured to meet the requirements for chips with frequency up to 18 GHz, including GaN devices. These molded ceramic packages come in more than 200 standard outlines, dramatically increasing the packaging options for GaN devices. The company also offers complete automated assembly and test services for these packages, including gold-tin solder die attach. GaN devices are traditionally packaged in the company’s LL family of high-power laminate copper-moly-copper (CMC) base packages with a ratio of 1:3:1 CMC. These packages accommodate frequencies up to 63 GHz. In the molded ceramic package, the standard ASTM F15 alloy base can be replaced with CMC. For frequencies of 18 GHz or less, using a molded ceramic package provides the advantages of hermeticity, a broad array of outline packages, and lower cost, while the CMC provides the heat dissipation needed for GaN devices to meet requirements for aerospace applications. For SMT applications, these packages can be manufactured with gull-wing formed leads. They offer flexibility because it’s inexpensive to change the lead design to match an existing footprint.