by Chuck Casson, VP Sales and Program Management, Teledyne Microwave Solutions, RF&M Group
MPD: Many technologies are driving RF and microwave technologies today. Which ones do you feel are the most important as it concerns your company’s work?
There are a variety of technologies that we monitor and actively invest in closely for advancements within the market. One of those key technological capabilities that continues to have our focus has been the advancement of gallium nitride. GaN process maturity and product development provide us with opportunities to expand the availability of products that perform at higher power levels, with greater linearity, and expanded higher frequency bands. As maturity and affordability increases on discrete and packaged GaN-based MMICs, Teledyne has been able to leverage these products and processes to provide small compact high power and higher frequency SSPA solutions for the land, sea, airborne and space environments.
MPD: If your company serves the defense market, what are you working on (that you can talk about)?
As GaN capabilities expand, the need for more advanced thermal management becomes critical. Teledyne is working with several technologies to allow for more dense packaging and higher power products while improving reliability. TMS is utilizing a multi-pronged approach combining passive cooling and heat spreading, active cooling, and materials selection to meet the increased SWaP demands of our defense customers. Solving this challenge also allows for more power-combining capabilities, further expanding the ability to develop products that can support emerging warfighter needs.