by David Vye, Director of Technical Marketing, AWR Group, NI Performance targets for 5G New Radio (NR) require the use of cyclic-prefix orthogonal frequency-division multiplexing (CP-OFDM) waveforms, as well as […]

by AWR Group, NI Today’s RF/mixed-signal printed circuit boards (PCBs) employ complex board structures to support greater functionality for specific applications. Within these densely-populated, multi-layer boards, integration of high-speed data […]

by John Dunn, Ph.D. – AWR Group, NI Electromagnetic (EM) simulators are constantly being improved in various ways, however, less obvious to RF engineers yet equally important are the advances […]

by Shane Coffman, Senior Applications Engineer – AWR Group, NI Multi-technology-based module design incorporates different integrated circuit (IC) and printed circuit board (PCB) process technologies implemented with different design tools. […]

by National Instruments This application note demonstrates a simulation-based methodology for broadband power amplifier (PA) design using load-line, load-pull, and real-frequency synthesis techniques. The design highlighted in this application note […]