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Qorvo® Wins U.S. Government Project to Create Advanced, State-of-the-Art, RF Semiconductor Packaging Center

Qorvo®, a leading provider of innovative RF solutions that connect the world, has been selected by the U.S. government to create a State-of-the-Art (SOTA) Heterogeneous Integrated Packaging (SHIP) RF production […]

Advances in Heterogeneous Integration for RF SiP Packaging

by Kevin Anderson, Qorvo Infrastructure and Defense Products The development and implementation of RF component packaging technology is facing pressure on several fronts. These include ever-increasing demands for reduced size, […]

Ka-Band SATCOM Trends and Power Amplification Challenges

by Qorvo The ever-expanding appetite for data is driving strong growth in satellite communications (SATCOM), especially in higher-frequency bands. But, instead of concentrating on the lower frequency ranges, many companies […]