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Advances in Heterogeneous Integration for RF SiP Packaging

by Kevin Anderson, Qorvo Infrastructure and Defense Products The development and implementation of RF component packaging technology is facing pressure on several fronts. These include ever-increasing demands for reduced size, […]

Ka-Band SATCOM Trends and Power Amplification Challenges

by Qorvo The ever-expanding appetite for data is driving strong growth in satellite communications (SATCOM), especially in higher-frequency bands. But, instead of concentrating on the lower frequency ranges, many companies […]

Solving 5G mmWave Phased Array System Efficiency Challenges with the Qorvo QPF4010

by David Schnaufer, Technical marketing communications manager & David Rahn, Senior product line manager, Qorvo 5G deployments are in full swing worldwide. In the U.S., 5G is being rolled out […]

Advancements in High Frequency Plastic Air Cavity Packaging

by Helen Leung and Erik Sauve, Custom MMIC RF and microwave design engineers are continuously pushing the development of Monolithic Microwave Integrated Circuits (MMICs) to higher frequencies. New advanced packaging […]