MPD Fully Functioning During the Covid-19 Emergency

We just thought we’d let all of you know that it is business as usual at Octagon Communications and MPD. All necessary precautions have been taken, and, as several of our staffers already work remotely, the office is open for business until we are told otherwise.

The July issue of MPD will arrive on schedule, and of course our website and the digital edition will continue to be available.

Feel free to contact any of us with questions or concerns!

We hope that you and your families are safe and healthy.

Home Tag "Qorvo"
Featured Articles

Advances in Heterogeneous Integration for RF SiP Packaging

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by Kevin Anderson, Qorvo Infrastructure and Defense Products The development and implementation of RF component packaging technology is facing pressure on several fronts. These include ever-increasing demands for reduced size, […]
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The Evolution of GaN: from Defense Applications to 5G

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Design of a Broadband L-band 160W GaN Power Amplifier Using SMT Packaged Transistors 

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Ka-Band SATCOM Trends and Power Amplification Challenges

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by Qorvo The ever-expanding appetite for data is driving strong growth in satellite communications (SATCOM), especially in higher-frequency bands. But, instead of concentrating on the lower frequency ranges, many companies […]
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Rapid Model-Based Evaluation Board Success for a 160W L-Band GaN PA 

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The Impact of the IoT on Society

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Solving 5G mmWave Phased Array System Efficiency Challenges with the Qorvo QPF4010

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by David Schnaufer, Technical marketing communications manager & David Rahn, Senior product line manager, Qorvo 5G deployments are in full swing worldwide. In the U.S., 5G is being rolled out […]
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The Evolution of GaN: from Defense Applications to 5G

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Design of a Broadband L-band 160W GaN Power Amplifier Using SMT Packaged Transistors 

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Advancements in High Frequency Plastic Air Cavity Packaging

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by Helen Leung and Erik Sauve, Custom MMIC RF and microwave design engineers are continuously pushing the development of Monolithic Microwave Integrated Circuits (MMICs) to higher frequencies. New advanced packaging […]
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Overcoming Wireless Infrastructure Capacity Challenges with GaN

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No Vacuum Regarding Opinions for RF Power Amplification

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