The Volta Series probe heads are optimized for wafer level chip scale package testing. Volta is used for testing the powerful integrated chips (while in wafer form) that are behind […]
by Smiths Interconnect If it’s solving design challenges of directivity and throughput in 5G communications applications or providing enhanced anti-jamming and tracking agility, phased array antennas, or actively electronically steered […]
Smiths Interconnect, a division of Smiths Group plc, today announces it is unifying its technology brands of EMC Technology, Hypertac, IDI, Lorch, Millitech, RF Labs, Sabritec, TECOM, and TRAK under […]
Smiths Interconnect, a division of Smiths Group plc, today announces it is unifying its technology brands of EMC Technology, Hypertac, IDI, Lorch, Millitech, RF Labs, Sabritec, TECOM, and TRAK under […]