Thin-film Bandpass Filters
The Planar X Series of thin-film bandpass filters are designed for applications in harsh environments and provide system engineers with a compact solution for critical RF filtering in X, Ku, […]
Volta Series Probe Heads
The Volta Series probe heads are optimized for wafer level chip scale package testing. Volta is used for testing the powerful integrated chips (while in wafer form) that are behind […]
Microwave Circulators Evolve to Meet True Surface Mount Requirements of Advanced Systems
by Smiths Interconnect If it’s solving design challenges of directivity and throughput in 5G communications applications or providing enhanced anti-jamming and tracking agility, phased array antennas, or actively electronically steered […]
Smiths Interconnect Launches BrandTransition to Simplify Customer Access to Technologies and Solutions
Smiths Interconnect, a division of Smiths Group plc, today announces it is unifying its technology brands of EMC Technology, Hypertac, IDI, Lorch, Millitech, RF Labs, Sabritec, TECOM, and TRAK under […]
Smiths Interconnect Launches Brand Transition
Smiths Interconnect, a division of Smiths Group plc, today announces it is unifying its technology brands of EMC Technology, Hypertac, IDI, Lorch, Millitech, RF Labs, Sabritec, TECOM, and TRAK under […]
