Packages for GaN Devices
The Leaded Laminate (LL) Series is designed for packaging high-power GaN devices and has high thermal dissipation resulting from the use of copper-moly-copper laminates for eutectic solder attachment of the […]
Our May 2022 IMS2022 review issue of MPD is available!
The May edition covered board materials, DOD cable & connector standards, IOT & wireless sensors with articles by Isola, Pasternack, NXP, and L-com. Analog Devices, Inc. contributed an in-depth look at Software Defined Radios. The “In My Opinion” column, “Debunking the Myths About Millimeter Wavelengths for 5G,” was contributed by Reza Roufougaran, CTO, Movandi.
Click below to read the May 2022 issue of MPD!